Modular electronic testing system with flexible test pcb format

ABSTRACT

A testing system for test sockets is presented having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A top stiffener is attached to the lower surface of the DUT PCB and is locked in place by engagement members of a locking mechanism, that is operated by an actuating mechanism, that includes a rack and pinion arrangement that converts rotational movement of the pinions to lateral movement of the racks thereby locking the stiffener connected to the DUT PCB to the socket plate so as to facilitate testing. The upper surface of the DUT PCB has an infinite top plane that is uninterrupted and can be of any size and shape. The system is also modular and can be formed of any number of modules depending on the pin count density required.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. patent applicationSer. No. 16/983,309 filed on Aug. 3, 2020, which claims priority to U.S.Provisional Patent Application No. 62/882,891 filed Aug. 5, 2019, andwhich is hereby fully incorporated by reference herein in its entirety.

FIELD OF THE DISCLOSURE

This disclosure relates to a testing system. More specifically andwithout limitation, this disclosure relates to a testing system fortesting electrical interconnects, also known as test sockets, as well astesting boards, and related methods of use.

BACKGROUND OF THE DISCLOSURE

Semiconductor chips have been developed for a wide variety of purposes.Along with the development of these semiconductor chips, a needdeveloped to test these semiconductor chips to ensure that they aremanufactured within specified tolerances and function properly. Manymanufacturers of semiconductor chips such as Intel®, AMD®, Xilinx®,Texas Instruments®, NVIDIA®, Qualcomm®, among countless others,manufacture semiconductor chips which are then tested by a chip testingsystem having a device under test printed circuit board (DUT PCB) withan electrical interconnect, also known as a test socket, that isattached thereto. The DUT PCB and electrical interconnects are generallycustom made to fit each specific semiconductor chip, making them quiteexpensive.

Manufacturers tend to simultaneously manufacture a variety ofsemiconductor chips within their facilities to maximize their overheadand equipment utilization rates. Due to these multiple product lines,manufacturers have a need to test a variety of semiconductor chips atthe same time, each type of chip requiring a special electricalinterconnect and DUT PCB. Since cleanroom space is extremely limited itis undesirable to have a dedicated testing machine for each type ofelectrical interconnects and DUT PCB. Conventional testing systems arenot capable of testing a plurality of electrical interconnects, nor areconventional testing systems easily converted between configurations fortesting different electrical interconnects.

Therefore, manufacturers of semiconductor chips have a need for a systemfor testing electrical interconnects, and DUT PCBs, that is capable oftesting a variety of electrical interconnects and DUT PCBs.Manufacturers of semiconductor chips also have a need for a system fortesting electrical interconnects, and DUT PCBs, that quickly and easilyconverts between testing various electrical interconnects, which areproblems not solved by the prior art. Manufacturers of semiconductorchips further have a need for this testing system to be as small aspossible to maximize valuable cleanroom space.

Thus, it is a primary object of the disclosure to provide an electronictesting system and method of use that improves upon the state of theart.

Another object of the disclosure is to provide an electronic testingsystem and method of use that quickly converts between configurationsfor testing different electrical interconnects.

Yet another object of the disclosure is to provide an electronic testingsystem and method of use that easily converts between configurations fortesting different electrical interconnects.

Another object of the disclosure is to provide an electronic testingsystem and method of use that is easy to use.

Yet another object of the disclosure is to provide an electronic testingsystem and method of use that provides accurate testing for electricalinterconnects.

Another object of the disclosure is to provide an electronic testingsystem and method of use that can be used with a wide variety ofelectrical interconnects.

Yet another object of the disclosure is to provide an electronic testingsystem and method of use that is relatively inexpensive.

Another object of the disclosure is to provide an electronic testingsystem and method of use that has a long useful life.

Yet another object of the disclosure is to provide an electronic testingsystem and method of use that has a small footprint.

Another object of the disclosure is to provide an electronic testingsystem and method of use that minimizes the amount of space required totest a variety of electrical interconnects.

Yet another object of the disclosure is to provide an electronic testingsystem and method of use that minimizes the capital cost for testingequipment for testing a variety of electrical interconnects.

Another object of the disclosure is to provide an electronic testingsystem and method of use that provides for quick removal of andreplacement of DUT PCBs having electrical interconnects thereon.

Yet another object of the disclosure is to provide an electronic testingsystem and method of use that is high quality.

Another object of the disclosure is to provide an electronic testingsystem and method of use that is durable.

Yet another object of the disclosure is to provide an electronic testingsystem and method of use that can be used with a wide variety of othertesting equipment.

Another object of the disclosure is to provide an electronic testingsystem and method of use that is modular in nature.

Yet another object of the disclosure is to provide an electronic testingsystem and method of use that can be used with any size of DUT PCB.

Another object of the disclosure is to provide an electronic testingsystem and method of use that can be used with any test socket.

Yet another object of the disclosure is to provide an electronic testingsystem and method of use that provides a high density of pins.

Another object of the disclosure is to provide an electronic testingsystem and method of use that can be formed out of a plurality oftesting modules.

Yet another object of the disclosure is to provide an electronic testingsystem and method of use that has a flat upper surface so as to notinterfere with other equipment.

These and other objects, features, or advantages of the presentdisclosure will become apparent from the specification and claims.

SUMMARY OF THE DISCLOSURE

A testing system for test sockets is presented having a removable deviceunder test printed circuit board (DUT PCB) that electrically connectswith the electrical testing components of the system. A top stiffener isattached to the lower surface of the DUT PCB and is locked in place byengagement members of a locking mechanism that are operated by anactuating mechanism that includes a rack and pinion arrangement thatconverts rotational movement of the pinions to lateral movement of theracks thereby locking the stiffener connected to the DUT PCB to thesocket plate so as to facilitate testing. The upper surface of the DUTPCB has an infinite top plane that is uninterrupted and can be of anysize and shape. The system is also modular and can be formed of anynumber of modules depending on the pin count density required.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a module of a Modular Electronic TestingSystem with Flexible Test PCB Format, the view showing the moduleconsisting of a housing, with a socket plate, actuating mechanism,locking mechanism, top stiffener, and a single capsule assembled ontothe housing;

FIG. 2 is another perspective view of a module of the testing system,the view showing the module consisting of a housing, with a socketplate, actuating mechanism, locking mechanism, top stiffener, and amultitude of capsules assembled onto the housing;

FIG. 3 is an exploded perspective view of a module of the testingsystem, the view showing the housing, the socket place with the lockingmechanism and actuating mechanism assembled to the socket plate, theelectrical testing components consisting of a motherboard and cardassemblies operatively connected to the motherboard, the capsules, andthe top stiffener all separated from one another;

FIG. 4 is a top elevation view of the module described in FIG. 1;

FIG. 5 is a side elevation view of the module described in FIG. 1;

FIG. 6 is another side elevation view of the module described in FIG. 1;

FIG. 7 is an end elevation view of the module described in FIG. 1;

FIG. 8 is another end elevation view of the module described in FIG. 1;

FIG. 9 is a cut-away perspective view through an end of the testingsystem, with a module as well as a device under test printed circuitboard (DUT PCB) with a test socket and device under test (DUT) connectedto the DUT PCB, the view cut through the axis of rotation of a post ofthe locking mechanism, the view showing the DUT PCB operativelyconnected to the top stiffener and arms of the locking mechanismengaging bearings within slots of the top stiffener in order to bringDUT PCB into electrical connection with the electrical testingcomponents of the testing system, the view also showing an electricaltesting board which is one of many that are electrically connected tothe DUT PCB in order to test the DUT connected to the test socket, theview showing fans and vents which are configured to cool the electricaltesting components of the testing system, the view also showing powersupplies of the module;

FIG. 10 is a perspective view of the cut-away view of FIG. 9, the viewshowing the DUT PCB disconnected and exploded away from the topstiffener, the view also showing capsules within sockets of the topstiffener which facilitate connection of DUT PCB to the electricaltesting components of the system through compressible electricalcontacts;

FIG. 11 is a perspective view of the cut-away view of FIG. 10, the viewshowing the capsules removed from the sockets and exploded away from thetop stiffener;

FIG. 12 is a cut-away perspective view of the module described in FIG.1, the view cut through the axis of rotation of a post of the lockingmechanism, the view showing the arms of an engagement member of thelocking mechanism engaging bearings within slots of the top stiffener inorder to bring the top stiffener into close contact with the socketplate, the view also showing electrical testing boards, the view showingfans and vents which are configured to cool the electrical testingcomponents of the testing system, the view also showing power suppliesof the module;

FIG. 13 is a cut-away perspective view of the module described in FIG.1, the view cut through an end of the housing of the testing system, theview showing the rack and pinion of the locking mechanism as well as ahead of the locking mechanism, the view also showing the hollow interiorof the housing, the view also showing an electrical testing board;

FIG. 14 is a perspective view of the cut-away view of FIG. 13, the viewshowing the lower surface of the bottom plate of the housing, the viewshowing racks and pinions of locking mechanism, the view also showingelectrical testing boards,

FIG. 15 is a cut-away elevation view through an end of the testingsystem of FIG. 1, the view showing the hollow interior of the housing,the view also showing a plug, switch, and data port located on the endof the housing, the view also showing an electrical testing board, theview also showing power supplies of the module;

FIG. 16 is an elevation view from an end of the cut-away view of FIG.15, the view also showing arms of an engagement member of the lockingmechanism engaging bearings within slots of the top stiffener in orderto bring the top stiffener into close contact with the socket plate;

FIG. 17 is a perspective view of the socket plate of a module of thetesting system, the view showing the actuating mechanism, the view alsoshowing racks and pinions of the locking mechanism, the view alsoshowing sockets in the socket plate, the view also showing alignmentpins;

FIG. 18 is a close-up elevation cut-away view of multiple capsulesconnected to a motherboard, the view cut through the axis of rotation ofa fastener used to connect the capsules to the motherboard, the viewshowing the capsules connected to the motherboard by the fastener, theview also showing compressible electrical contacts of the capsule, theview also showing electrical testing boards connected to sockets whichconnect to the motherboard, the view also showing a post, rack andpinion, and stop of the locking mechanism;

FIG. 19 is a close-up elevation cut-away view of multiple capsulesconnected to a motherboard, the view cut through the approximateend-to-end middle of a capsule, the view showing capsules connected tothe mother board, the view also showing electrical testing boardsconnected to sockets which connect to the motherboard, the view alsoshowing a post, rack and pinion, and stop of the locking mechanism;

FIG. 20 is a cut-away elevation view of the testing system, the view cutthrough the approximate end-to-end middle of a capsule, the view showinga DUT PCB connected to the top stiffener, the view showing two testsockets connected to the DUT PCB and a DUT connected to each testsocket, the view showing electrical testing boards connected to socketsconnected to the motherboard, which is electrically connected to the DUTPCB through the capsules;

FIG. 21 is a perspective view of a test system, the view showing amodule connected to a DUT PCB with two test sockets connected to the DUTPCB and a DUT connected to each test socket, the view showing a pedestalsupporting one side of the DUT PCB;

FIG. 22 is an end elevation view of the test system of FIG. 21;

FIG. 23 is a perspective view of a test system, the view showing twomodules each connected to one side of the DUT PCB, the view also showingone test socket connected to the DUT PCB and a DUT connected to the testsocket, the view also showing a docking station;

FIG. 24 is an exploded view of the test system of FIG. 23;

FIG. 25 is another exploded view of the test system of FIG. 23;

FIG. 26 is a perspective view of a test system, the view showing twomodules each connected to one side of a pedestal, the view also shows aDUT PCB disconnected from the modules, the view also showing anenvironmental chamber disconnected from the DUT PCB with a stepperconnected to the environmental chamber;

FIG. 27 is a cut-away end elevation view of the testing system, the viewshowing two modules each connected to a side of a DUT PCB with a testsocket and an environmental chamber connected to the DUT PCB, the viewalso showing the interior of the environmental chamber with the steppershown protruding through the top of the environmental chamber and downtowards the test socket on the DUT PCB, the view also showing electricaltesting boards within each module;

FIG. 28 is a partial cut-away side elevation view of the testing system,the view showing a module, the view also showing a DUT PCB connected tothe module and a test socket and an environmental chamber connected tothe DUT PCB, the view showing the environmental chamber cut-away at theside making the interior viewable, the view also showing a stepperprotruding through the top of the environmental chamber and down towardsthe test socket on the DUT PCB;

FIG. 29 is a perspective view of a DUT PCB, the view showing the lowersurface of the DUT PCB with electrical contacts on the lower surface;

FIG. 30 is another perspective view of FIG. 29;

FIG. 31 is an exploded perspective view of a capsule, the view showingtwo halves of the capsule separated from each other, the view alsoshowing the compressible electrical contacts, fasteners which secure thetwo halves of the capsule together, and fasteners which secure thecapsule to the motherboard in a fully assembled module;

FIG. 32 is a perspective view of a capsule, the view showing the twohalves connected together by use of fasteners, the view also showing thecompressible electrical contacts, the view also showing the fastenerswhich secure the capsule to the motherboard fastened within the capsule;

FIG. 33 is another perspective view of the capsule of FIG. 32;

FIG. 34 is a side elevation view of the capsule of FIG. 32;

FIG. 35 is a top elevation view of the bottom half of a capsule, theview showing the bottom half with holes for the compressible electricalcontacts and for the fasteners which secure the top half to the bottomhalf, as well as holes which secure the capsule to the motherboard;

FIG. 36 is a top elevation view of the capsule of FIG. 32.

DETAILED DESCRIPTION OF THE DISCLOSURE

In the following detailed description of the embodiments, reference ismade to the accompanying drawings, which form a part hereof, and inwhich is shown by way of illustration specific embodiments in which thedisclosure may be practiced. The embodiments of the present disclosuredescribed below are not intended to be exhaustive or to limit thedisclosure to the precise forms in the following detailed description.Rather, the embodiments are chosen and described so that others skilledin the art may appreciate and understand the principles and practices ofthe present disclosure. It will be understood by those skilled in theart that various changes in form and details may be made withoutdeparting from the principles and scope of the invention. It is intendedto cover various modifications and similar arrangements and procedures,and the scope of the appended claims therefore should be accorded thebroadest interpretation so as to encompass all such modifications andsimilar arrangements and procedures. For instance, although aspects andfeatures may be illustrated in or described with reference to certainfigures or embodiments, it will be appreciated that features from onefigure or embodiment may be combined with features of another figure orembodiment even though the combination is not explicitly shown orexplicitly described as a combination. In the depicted embodiments, likereference numbers refer to like elements throughout the variousdrawings.

It should be understood that any advantages and/or improvementsdiscussed herein may not be provided by various disclosed embodiments,or implementations thereof. The contemplated embodiments are not solimited and should not be interpreted as being restricted toembodiments, which provide such advantages or improvements. Similarly,it should be understood that various embodiments may not address all orany objects of the disclosure or objects of the invention that may bedescribed herein. The contemplated embodiments are not so limited andshould not be interpreted as being restricted to embodiments whichaddress such objects of the disclosure or invention. Furthermore,although some disclosed embodiments may be described relative tospecific materials, embodiments are not limited to the specificmaterials or apparatuses but only to their specific characteristics andcapabilities and other materials and apparatuses can be substituted asis well understood by those skilled in the art in view of the presentdisclosure.

It is to be understood that the terms such as “left, right, top, bottom,front, back, side, height, length, width, upper, lower, interior,exterior, inner, outer, and the like as may be used herein, merelydescribe points of reference and do not limit the present invention toany particular orientation or configuration.

As used herein, “and/or” includes all combinations of one or more of theassociated listed items, such that “A and/or B” includes “A but not B,”“B but not A,” and “A as well as B,” unless it is clearly indicated thatonly a single item, subgroup of items, or all items are present. The useof “etc.” is defined as “et cetera” and indicates the inclusion of allother elements belonging to the same group of the preceding items, inany “and/or” combination(s).

As used herein, the singular forms “a,” “an,” and “the” are intended toinclude both the singular and plural forms, unless the languageexplicitly indicates otherwise. Indefinite articles like “a” and “an”introduce or refer to any modified term, both previously-introduced andnot, while definite articles like “the” refer to a samepreviously-introduced term; as such, it is understood that “a” or “an”modify items that are permitted to be previously-introduced or new,while definite articles modify an item that is the same as immediatelypreviously presented. It will be further understood that the terms“comprises,” “comprising,” “includes,” and/or “including,” when usedherein, specify the presence of stated features, characteristics, steps,operations, elements, and/or components, but do not themselves precludethe presence or addition of one or more other features, characteristics,steps, operations, elements, components, and/or groups thereof, unlessexpressly indicated otherwise. For example, if an embodiment of a systemis described as comprising an article, it is understood the system isnot limited to a single instance of the article unless expresslyindicated otherwise, even if elsewhere another embodiment of the systemis described as comprising a plurality of articles.

It will be understood that when an element is referred to as being“connected,” “coupled,” “mated,” “attached,” “fixed,” etc. to anotherelement, it can be directly connected to the other element, and/orintervening elements may be present. In contrast, when an element isreferred to as being “directly connected,” “directly coupled,” “directlyengaged” etc. to another element, there are no intervening elementspresent. Other words used to describe the relationship between elementsshould be interpreted in a like fashion (e.g., “between” versus“directly between,” “adjacent” versus “directly adjacent,” “engaged”versus “directly engaged,” etc.). Similarly, a term such as“operatively”, such as when used as “operatively connected” or“operatively engaged” is to be interpreted as connected or engaged,respectively, in any manner that facilitates operation, which mayinclude being directly connected, indirectly connected, electronicallyconnected, wirelessly connected or connected by any other manner, methodor means that facilitates desired operation. Similarly, a term such as“communicatively connected” includes all variations of informationexchange and routing between two electronic devices, includingintermediary devices, networks, etc., connected wirelessly or not.Similarly, “connected” or other similar language particularly forelectronic components is intended to mean connected by any means, eitherdirectly or indirectly, wired and/or wirelessly, such that electricityand/or information may be transmitted between the components.

It will be understood that, although the ordinal terms “first,”“second,” etc. may be used herein to describe various elements, theseelements should not be limited to any order by these terms unlessspecifically stated as such. These terms are used only to distinguishone element from another; where there are “second” or higher ordinals,there merely must be a number of elements, without necessarily anydifference or other relationship. For example, a first element could betermed a second element, and, similarly, a second element could betermed a first element, without departing from the scope of exampleembodiments or methods.

Similarly, the structures and operations discussed herein may occur outof the order described and/or noted in the figures. For example, twooperations and/or figures shown in succession may in fact be executedconcurrently or may sometimes be executed in the reverse order,depending upon the functionality/acts involved. Similarly, individualoperations within example methods described below may be executedrepetitively, individually or sequentially, to provide looping or otherseries of operations aside from single operations described below. Itshould be presumed that any embodiment or method having features andfunctionality described below, in any workable combination, falls withinthe scope of example embodiments.

System:

With reference to the figures, a testing system 10 (or simply system 10)is presented. Testing system 10 is formed of any suitable size, shapeand design and is configured to facilitate testing of test sockets 12and/or DUT PCBs 14. In the arrangement shown, as one example, testingsystem 10 may be formed of one or more modules 16. In the arrangementshown, as one example, module 16 of testing system 10 includes a housing18, a socket plate 20 an actuating mechanism 22 and a locking mechanism24, electrical testing components 26 including card assemblies 28 havinga mother board 30 having a plurality of electrical sockets 32 thatconnect to electrical testing boards 34, a plurality of capsules 36, atop stiffener 38, a device under test printed circuit board (or DUT PCB)14 and at least one electrical interconnect also known as test socket12, among other components as is further described herein.

Housing:

In the arrangement shown, as one example, modules 16 of testing system10 include a housing 18. Housing 18 is formed of any suitable size,shape and design and is configured to house and hold and shelter andsecure and support various components of the system 10, as is furtherdescribed herein. In the arrangement shown, as one example, housing 18is generally square or rectangular in shape and forms a generally hollowinterior 40 which houses other components of the system 10, as isfurther described herein.

Frame Assembly: In the arrangement shown, as one example, housing 18includes a frame assembly 42. Frame assembly 42 is formed of anysuitable size, shape and design and is configured to provide structuralsupport and integrity to module 16. In the arrangement shown, frameassembly 42 is a generally square or rectangular shaped member thatforms hollow interior 40.

Sidewalls: In the arrangement shown, as one example, housing 18 includespair of opposing sidewalls 44 that connect to frame assembly 42 andextend in a generally planar manner from a lower end 46 to an upper end48 in approximate parallel planar spaced relation to one another;opposing sidewalls 44 also extend in a generally planar manner betweenopposing outward ends 50 in approximate parallel planar spaced relationto one another. Sidewalls 44 connect at their outward ends 50 at or nearor to end walls 52.

End Walls: In the arrangement shown, as one example, housing 18 includesa pair of opposing end walls 52 that connect to frame assembly 42. Likesidewalls 44, end walls 52 extend in a generally planar manner from alower end 54 to an upper end 56 in approximate parallel planar spacedrelation to one another; opposing end walls 52 also extend in agenerally planar manner between opposing outward ends 58 in approximateparallel planar spaced relation to one another. End walls 52 connect attheir outward ends 58 at or near or to the outward ends 50 of sidewalls44.

Bottom Plate: In the arrangement shown, as one example, housing 18includes a bottom plate 59. Bottom plate 59 is formed of any suitablesize, shape and design and is configured to enclose the lower end ofmodule 16 and/or for placement on a table, desk or other surface, oralternatively for connecting system 10 to another machine, such as asemiconductor testing system, automated testing system, a pick and placemachine or any other machine or device. In the arrangement shown, as oneexample, bottom plate 59 is a generally planar square or rectangularshaped member that connects to the lower end of frame assembly 42.

In the arrangement shown, as one example, sidewalls 44 connect at theirlower end 46 at or near or to bottom plate 59, and end walls 52 connectat their lower end 54 at or near or to bottom plate 59. Bottom plate 59is generally planar in shape and defines a generally planar uppersurface 61 and a generally planar lower surface 60.

In the arrangement shown, as one example, sidewalls 44 connect at theiroutward ends 50 at or near or to the outward ends 58 of end walls 52 andsidewalls 44 and end walls 52 are arranged in approximate perpendicularalignment to one another. In the arrangement shown, as one example, theplane of bottom plate 59 extends in approximate perpendicular planaralignment to the plane of sidewalls 44. In the arrangement shown, as oneexample, the plane of bottom plate 59 extends in approximateperpendicular planar alignment to the plane of end walls 52. In thisway, the arrangement of sidewalls 44 to end walls 52 to bottom plate 59form a generally square or rectangular box or frame that forms housing18 that houses many of the components shown and described herein,including most if not all of the electrical testing components 26.However, any other size or shape of frame housing 18 is herebycontemplated for use.

Fans & Vents: In the arrangement shown, as one example, housing 18includes a plurality of fans 62 that connect to vents 64. Fans 62 areformed of any suitable size, shape and design and are configured tofacilitate air movement within the hollow interior 40 of housing 18 soas to keep the electrical testing components 26 and otherheat-generating electrical components housed within housing 18 cool. Dueto the high density of electrical components positioned within thehollow interior 40 of housing 18, module 16 generates a large amount ofheat. As such, fans 62 are configured to facilitate air flow that keepsthese electrical components cool and prevents overheating. In thearrangement shown, as one example, fans 62 are electrical fans that areconnected to the interior surface of sidewalls 44 and/or end walls 52.

In the arrangement shown, as one example, a plurality of fans 62 arespaced across the interior surface of one of the sidewalls 44 whereasthe opposite sidewall 44 has no fans 62 but includes vents 64 thatextend across a large portion of the sidewall 44. In this arrangement,air is pushed or pulled across the hollow interior 40 of housing 18 byfans 62 through vents 64. This high density of fans 62 facilitates highlevels of air movement.

In the arrangement shown, as one example, a fan 62 is also connected tothe interior surface of both end walls 52. Like the fans 62 in sidewalls44, the fans 62 in end walls 52 move air through vents 64 in end walls52.

Any number of fans 62 is hereby contemplated for use in housing 18 as isany placement of fans 62. Similarly, any number or configuration ofvents 64 is hereby contemplated for use in housing 18 as is anyplacement of vents 64. In addition, any other manner, method or means ofcooling the electrical components of module 16 is hereby contemplatedfor use such as the use of refrigerant, or the like.

Power Supplies & Other Electrical Components: In the arrangement shown,as one example, the hollow interior 40 of housing 18 also houses andholds a plurality of power supplies 66 and other electrical componentsthat facilitate operation of the module 16 and system 10. In thearrangement shown, as one example, these power supplies 66 and otherelectrical components are connected to the upper surface 61 of bottomplate 59, however any other placement and arrangement is herebycontemplated for use.

Cross Supports: In the arrangement shown, as one example, housing 18includes a plurality of cross supports 68. Cross supports 68 are formedof any suitable size, shape and design and are configured to connectopposing sidewalls 44 adjacent the open upper end of housing 18. In thearrangement shown, three cross supports 68 are shown in use that extendthe distance between opposing sidewalls 44 just below the open upper endof housing 18. In the arrangement shown, as one example, one crosssupport 68 is generally positioned at the approximate center of housing18 and the other cross supports 68 are positioned a distance just inwardof end walls 52.

In one arrangement, as is shown, the upper surface of cross supports 68is positioned just below movable portions of locking mechanism 24. Inone arrangement, the upper surface of cross supports 68 engages and/orprovides support for movable portions of locking mechanism 24.

Plug, Switch, Data Port: In the arrangement shown, as one example,modules 16 include a plug 70, a switch 72 and a data port 74, amongother components. In the arrangement shown, as one example, plug 70,switch 72 and data port 74 are shown in one of the end walls 52, howeverany other placement and configuration is hereby contemplated for use.

Plug 70 is formed of any suitable size, shape and design and isconfigured to facilitate electrical connection to the electricalcomponents of the module 16. In the arrangement shown, as one example,plug 70 is a conventional 120-volt AC plug, however any other form of aplug or any number of plugs is hereby contemplated for use as is adirect wired connection.

Switch 72 is formed of any suitable size, shape and design and isconfigured to control the powering of the module 16. In the arrangementshown, as one example, switch 72 is a conventional on/off switch,however any other form of a switching mechanism is hereby contemplatedfor use.

Data port 74 is formed of any suitable size, shape and design and isconfigured to facilitate electrical connection to the electricalcomponents of the module 16 so as to facilitate the transfer ofinformation and/or data to and/or from the electrical components ofmodule 16. In the arrangement shown, as one example, data port 74 is aconventional USB port, however any other form of a data port 74 ishereby contemplated for use as well as the use of any number of dataports 74.

Socket Plate:

In the arrangement shown, as one example, modules 16 of testing system10 include a socket plate 20. Socket plate 20 is formed of any suitablesize, shape and design and is configured to connect to and enclose theupper end of the hollow interior 40 of housing 18 as well as providesupport for electrical testing components 26, among other features andfunctionalities.

In the arrangement shown, as one example, socket plate 20 is a generallyplanar member having a generally flat upper surface 76 and a generallyflat lower surface 78 that extend in approximate parallel planar spacedrelation to one another. In the arrangement shown, as one example,socket plate 20 extends a width between opposing sides 80 that extend inapproximate parallel spaced relation to one another. In the arrangementshown, as one example, socket plate 20 extends a length between opposingends 82 that extend in approximate parallel spaced relation to oneanother. In the arrangement shown, as one example, sides 80 and ends 82extend in approximate perpendicular alignment to one another therebyforming a generally square or rectangular member when viewed from aboveor below. In the arrangement shown, as one example, upper surface 76 andopposing lower surface 78 and sides 80 extend in approximateperpendicular alignment to one another thereby forming a generallysquare or rectangular member when viewed from a side 80. In thearrangement shown, as one example, upper surface 76 and opposing lowersurface 78 and ends 82 extend in approximate perpendicular alignment toone another thereby forming a generally square or rectangular memberwhen viewed from an end 82.

Sockets: In the arrangement shown, as one example, socket plate 20includes a plurality of sockets 84. Sockets 84 are formed of anysuitable size, shape and design and are configured to allow electricalcomponents of the module 16 to extend through the socket plate 20 andinto the hollow interior 40 of housing 18 while the upper surface 76provides support for the electrical testing components 26. In thearrangement shown, as one example, when viewed from above or below,sockets 84 are generally elongated square or rectangular openings thatextend through socket plate 20 from upper surface 76 to lower surface78. A plurality of sockets 84 extend in generally parallel spacedrelation to one another along the end 82 to end 82 length of socketplate 20 with the length of each socket 84 extending across the side 80to side 80 width of socket plate 20.

These sockets 84 are sized and shaped to receive and/or hold and/orallow a portion of the electrical testing components 26 to extendthrough the socket plate 20. In the arrangement shown, as one example,electrical testing components 26 are installed on module by insertingthe lower end of the electrical testing boards 34 through the sockets 84and lowering the electrical testing components 26 until the lowersurface of motherboard 30 rests upon the upper surface 76 of socketplate 20. In this fully assembled arrangement, an electrical socket 32and a portion of upper end of an electrical testing board 34 resideswithin each socket 84 of socket plate 20 with the remaining portion ofelectrical testing board 34 extending below the lower surface 78 ofsocket plate 20.

Fasteners: In the arrangement shown, as one example, socket plate 20 isconnected to the upper end of housing 18. Socket plate 20 may beconnected to housing 18 by any manner, method or means. In thearrangement shown, as one example, socket plate 20 is connected to theupper end of housing 18 by a plurality of fasteners 86. In thearrangement shown, as one example, a plurality of fasteners 86 extendthrough socket plate 20 around its outer peripheral upper edge and intohousing 18. In the arrangement shown, as one example, these fasteners 86extend through socket plate 20 and into the upper end of frame assembly42. In the arrangement shown, as one example, fasteners 86 are screws orbolts, however any other form of a fastener is hereby contemplated foruse.

Attaching socket plate 20 to housing 18 using a plurality of fasteners86 in this manner provides a strong, durable, robust and secure mannerof attachment. However, attaching socket plate 20 to housing 18 using aplurality of fasteners 86 in this manner makes it very difficult,complex and time consuming to remove the socket plate 20 from thehousing 18. In addition, removing socket plate 20 from housing 18 whenit is attached using a plurality of fasteners 86 in this manner requiresa certain level of skill as well as the use of various tools.

Alignment Pins: In the arrangement shown, as one example, socket plate20 includes a plurality of alignment pins 88. Alignment pins 88 areformed of any suitable size, shape and design and are configured tofacilitate the alignment of other components of the system 10 duringinstallation so as to facilitate quick, easy and precise alignment ofthese other components (such as electrical testing components 26, topstiffener 38 and DUT PCB 14 among other components). In the arrangementshown, as one example, alignment pins 88 are generally cylindricalmembers that extend upward out of the upper surface 76 of socket plate20. These alignment pins 88 are placed in precise locations that arematched in size, shape and position with corresponding openings or holesor edges or other alignment features in the components that areinstalled onto the socket plate 20.

The use of alignment pins 88 along with corresponding openings or holesor edges or other alignment features in the components that areinstalled onto the socket plate 20 facilitates quick, easy, precise anderror-free installation of the other components of the system 10. Thatis, in one arrangement, alignment pins 88 along with correspondingopenings or holes or edges or other alignment features in the componentsthat are installed onto the socket plate 20 are aligned in a manner thatprevents the other components from being installed in an incorrectmanner. This is often known as “poka-yoke,” or designing components in amanner that does not allow them to be assembled in an incorrect manner.The use of alignment pins 88 in this manner in socket plate 20 alsofacilitates the installation of the other components of the system 10without any tools, which speeds assembly and disassembly and reducesassembly errors. To facilitate this, the alignment pins 88 may be formedof varying height and varying diameter as well.

In one arrangement, alignment pins 88 may also extend outward from thelower surface 78 of socket plate 20 so as to facilitate alignment ofsocket plate 20 to housing 18 during installation of the socket plate 20onto the housing 18.

In the arrangement shown, as one example, socket plate 20 includes alocking mechanism 24. In the arrangement shown, as one example, anactuating mechanism 22 is connected to and operates locking mechanism24.

Locking Mechanism:

In the arrangement shown, as one example, socket plate 20 includes alocking mechanism 24. Locking mechanism 24 is formed of any suitablesize, shape and design and is configured to facilitate locking orsecuring of other components to the system 10, once installed, to ensurethat they are securely held in place as well as to ensure that a goodelectrical connection is formed between the electrical components of thesystem 10.

Post: In the arrangement shown, as one example, locking mechanism 24includes at least one post 90. Post 90 is formed of any suitable size,shape and design and is configured to transfer rotational movement. Inthe arrangement shown, as one example, post 90 is generally cylindricalin shape and extends above the upper surface 76 of socket plate 20 adistance, through socket plate 20, and below the lower surface 78 ofsocket plate 20 a distance. The generally cylindrical shape of post 90facilitates rotational movement of post 90 as post 90 extends throughsocket plate 20. The extension of post 90 through socket plate 20coupled with the rotation of post 90 facilitates the transfer ofrotational movement that occurs above the upper surface 76 of socketplate 20 or outside of the hollow interior 40 of housing 18, intorotational movement below the lower surface 78 of socket plate 20 andinto the hollow interior 40 of housing 18. In the arrangement shown, asone example, the axis of rotation of post 90 extends through socketplate 20 in a generally perpendicular alignment to the plane formed bythe upper surface 76 or lower surface 78 of socket plate 20.

Head & Pinion: In the arrangement shown, as one example, the upper endof post 90 includes an enlarged head 92 positioned above the uppersurface 76 of socket plate 20. In the arrangement shown, as one example,the lower end of post 90 includes a pinion 94 having a plurality of gearteeth therein positioned below the lower surface 78 of socket plate 20.

Rack: In the arrangement shown, as one example, a rack 96 is positionedadjacent pinion 94 positioned at the lower end of the post 90. Rack 96is formed of any suitable size, shape and design and is configured tofacilitate lateral movement when post 90 rotates. In the arrangementshown, as one example, rack 96 is an elongated member having a pluralityof gear teeth positioned on a side adjacent pinion 94. The gear teeth ofrack 96 are similarly sized and shaped to the gear teeth in pinion 94and in this way the gear teeth of rack 96 mesh with the gear teeth ofpinion 94. In the arrangement shown, as one example, rack 96 extendsacross the lower surface 78 of socket plate 20 across the side 80 toside 80 width of socket plate 20.

Stop: In the arrangement shown, as one example, a stop 98 is positionedadjacent rack 96 on a side opposite pinion 94. Stop 98 is formed of anysuitable size, shape and design and is configured to hold rack 96 inplace as pinion 94 rotates while facilitating lateral movement of rack96. In this way, rack 96 is sandwiched between pinion 94 and stop 98.The presence of stop 98, opposite pinion 94, prevents pinion 94 frompushing rack 96 away as pinion 94 rotates. In one arrangement, as isshown, stop 98 includes a rotating bearing that reduces friction byfacilitating rotation as rack 96 moves laterally. As pinion 94 rotates,the gear teeth of pinion 94 mesh with the gear teeth of rack 96 andcause lateral movement of rack 96 while the stop 98 positioned oppositepinion 94 prevents rack 96 from pushing away from pinion 94. In this waylateral movement of rack 96 is facilitated within the hollow interior 40of housing 18 through rotational movement of pinion 94 outside of thehollow interior 40 of housing 18.

In the arrangement shown, as one example, the lower surface 100 of rack96 is positioned just above the upper surface of cross supports 68. Inone arrangement, cross supports 68 provide support to rack 96 and inthis arrangement, rack 96 slides over the upper surface of crosssupports 68 as rack 96 laterally moves within hollow interior 40 ofhousing 18.

Engagement Member: In the arrangement shown, as one example, anengagement member 102 is connected to the upper surface 104 of rack 96.Engagement member 102 is formed of any suitable size, shape and designand is configured engage other components of the system 10 and pull theminto secure and locked engagement as the engagement member 102 islaterally moved. In the arrangement shown, as one example, engagementmember 102 includes a pair of arms 106 that extend upward from rack 96.Arms 106 terminate at their upper end at flanges 108 that extend inapproximate perpendicular alignment to the vertical extension of arms106 and in approximate parallel spaced alignment to the length of rack96 and the direction of lateral movement of rack 96. An angled surface110 or cam surface is positioned at the outward end of flanges 108.Angled surface 110 angles from the tip of flange 108 downward, andtowards rack 96, as it extends towards arms 106.

In the arrangement shown, engagement member 102 includes a pair of arms106, each having a flange 108 and an angled surface 110. However, anynumber of arms 106 are hereby contemplated for use for each engagementmember 102.

In the arrangement shown, as one example, as rack 96 moves from adisengaged position to an engaged position, when top stiffener 38 is inplace on top of socket plate 20, the angled surface 110 of flanges 108of arms 106 of engagement members 102 engage bearings 112 connected totop stiffener 38. As engagement members 102 move laterally from adisengaged position to an engaged position, the angled surface 110 ofengagement member 102 slides over the bearing 112 of top stiffener 38thereby causing top stiffener 38 to be pulled toward socket plate 20thereby creating a secure connection as well as a secure electricalconnection. As engagement member 102 moves laterally from a disengagedposition to an engaged position, and the engagement member 102 engagestop stiffener 38, the top stiffener 38 is prevented from laterallymoving by contact and/or connection with alignment pins 88. As such,when engagement member 102 engages top stiffener 38 and moves from adisengaged position to an engaged position, top stiffener 38 is limitedto moving in a vertical manner toward socket plate 20.

In the arrangement shown, a flat section or slightly recessed section ispositioned just behind the angled surface 110 of flanges 108. This flator slightly recessed section is configured to hold bearings 112 thereinin a static manner when engagement member 102 is in a fully engagedposition. That is, when engagement member 102 moves to a fully engagedposition, bearings 112 are held in the flat or slightly recessed sectionrearward of the angled surface 110 which allows the top stiffener 38 tobe held therein indefinitely as the forces are neutral and there is nomotivation for the engagement member 102 to move in a disengagementdirection due to the forces between bearings 112 and engagement member102.

Also, in the arrangement shown, as one example, another set of bearings112 are positioned in the lower surface 78 of socket plate 20 thatengage the upper surface 104 of rack 96 so as to facilitate smooth andeasy and consistent lateral sliding of rack 96 between an engagementposition and a disengagement position. In the arrangement shown, as oneexample, two bearings 112 are used, one positioned on each outward endof slot 114 in socket plate 20.

In the arrangement shown, as one example, engagement members 102 extendthough slots 114 in socket plate 20. In this arrangement the upper endsof arms 106 of engagement members 102 extend above the upper surface 76of socket plate 20 a distance so as to facilitate engagement with topstiffener 38.

In the arrangement shown, as one example, three sets of posts 90, heads92, pinions 94, racks 96, stops 98, and engagement members 102 are shownin use in socket plate 20. In the arrangement shown, as one example, oneset of post 90, head 92, pinion 94, rack 96, stop 98, and engagementmember 102 is generally centrally positioned on socket plate 20, with amotherboard 30 having a plurality of sockets 32 and electrical testingboards 34 attached to the motherboard 30 positioned on each side of thiscentrally positioned set of post 90, head 92, pinion 94, rack 96, stop98, and engagement member 102. Also, in the arrangement shown, as oneexample, one set of posts 90, heads 92, pinions 94, racks 96, stops 98,and engagement members 102 are positioned adjacent each outward end 82of socket plate 20 with a motherboard 30 having a plurality of sockets32 and electrical testing boards 34 attached to the motherboard 30positioned on the inward facing side of the outward-positioned sets ofpost 90, head 92, pinion 94, rack 96, stop 98, and engagement member102. However any other number of sets of posts 90, heads 92, pinions 94,racks 96, stops 98, and engagement members 102 are hereby contemplatedfor use, such as one, two, three, four, five, six, seven, eight, nine,ten or more, as is any placement of these sets of components withinsocket plate 20.

In the arrangement shown, as one example, locking mechanism 24 iscontrolled by operation of actuating mechanism 22.

Actuating Mechanism:

In the arrangement shown, as one example, socket plate 20 includes anactuating mechanism 22. Actuating mechanism 22 is formed of any suitablesize, shape and design and is configured to facilitate movement oflocking mechanism 24 between a disengaged position and an engagedposition. In the arrangement shown, as one example, a manual orhand-operated actuating mechanism 22 is presented. However, it is herebycontemplated to use a powered or electrically powered or motorizedactuating mechanism 22 in place of the manual actuating mechanism 22presented in the figures.

In the arrangement shown, as one example, actuating mechanism 22includes an arm 116 having a handle 118. Arm 116 is formed of anysuitable size, shape and design and is configured to connect to lockingmechanism 24 and provide leverage to a user so as to facilitate manualoperation of the locking mechanism 24. In the arrangement shown, as oneexample, arm 116 extends a length between opposing ends. In thearrangement shown, as one example, a handle 118 is connected to an endof the arm 116. Handle 118 is formed of any suitable size, shape anddesign and is configured to provide a convenient and comfortable andfunctional grip for a user to grasp while operating the actuatingmechanism 22. In the arrangement shown, as one example, the end of arm116 opposite handle 118 is connected to locking mechanism 24.

In the arrangement shown, as one example, an end of arm 116 connects toone of the posts 90 of locking mechanism 24. In the arrangement shown,as one example, the end of arm 116 connects by a fastener to the uppersurface of the head 92 of one of the outward-positioned posts 90 oflocking mechanism 24, however any other arrangement or configuration ishereby contemplated for use.

In this way, the outward end, or end having handle 118 attached thereto,of arm 116 serves as a lever and provides leverage over lockingmechanism 24 that facilitates the easy and comfortable operation oflocking mechanism 24. The outward end of arm 116 rotates around the axisof rotation established by the post 90 that the inward end of arm 116 isconnected to. As such, as the outward end of arm 116 is rotated, thisrotation causes post 90 at the inward end of arm 116 to similarlyrotate.

In the arrangement shown, as one example, the upper end of post 90includes a tab 120 that connects to linkage 122 by fastener 124. Tab 120is formed of any suitable size, shape and design and is configured toconnect post 90 with linkage 122 so as to facilitate the transfer ofmovement and/or rotation from one post 90 of the locking mechanism 24 tothe other posts 90 of the locking mechanism 24. In the arrangementshown, as one example, tab 120 is a member that extends outward from theexterior surface of head 92 of post 90 in an approximate perpendicularalignment to the axis of rotation of post 90. In the arrangement shown,as one example, the outward end of tab 120 includes an opening thatreceives fastener 124 that extends through and connects tab 120 and post90 to linkage 122.

Linkage 122 is formed of any suitable size, shape and design and isconfigured to extend between and connect the plurality of posts 90 oflocking mechanism 24 so as to facilitate the simultaneous and precisetransfer of movement and/or rotation from one post 90 of the lockingmechanism 24 to the other posts 90 of the locking mechanism 24. In thearrangement shown, as one example, linkage 122 is formed of an elongatedbar that extends across and connects to the tabs 120 of all posts 90. Inthe arrangement shown, as one example, linkage 122 includes slots 126therein that receive the outward ends of tabs 120 therein. In thearrangement shown, as one example, linkage 122 includes an opening thatreceives fastener 124 that extends through and connects tab 120 and post90 to linkage 122.

In the arrangement shown, as one example, locking mechanism 24 includesthree sets of posts 90, heads 92, pinions 94, racks 96, stops 98, andengagement members 102, one set positioned at the approximate middle ofsocket plate 20 and one set positioned at each outward end 85 of socketplate 20. In the arrangement shown, as one example, arm 116 of actuatingmechanism 22 connects to an outward-positioned post 90. In thearrangement shown, as one example, linkage 122 connects at its outwardends to the outward positioned posts 90, and at its approximate middleto the middle-positioned post 90.

In this arrangement, as the handle 118 or outward end of arm 116 isrotated from a disengaged position to an engaged position, the inwardend of arm 116, which is connected to a post 90, rotates around the axisof rotation of the post 90 which simultaneously causes rotation of thepost 90. As the post 90 that is connected to arm 116 rotates, thisrotation causes tab 120 to simultaneously rotate. As tab 120 rotates,this causes linkage 122 to simultaneously move through the connection oftab 120 to linkage 122 by fastener 124. As linkage 122 moves, linkage122 causes the other posts 90 connected to linkage 122 to simultaneouslymove in a similar manner. In this way, the connection of linkage 122 toall posts 90 causes all posts 90 to simultaneously move. As all posts 90simultaneously rotate, this causes the pinions 94 which are connected toposts 90 to simultaneously rotate. As the pinions 94 simultaneouslyrotate, this causes the racks 96 to simultaneously move laterally. Asracks 96 simultaneously move laterally, this causes engagement members102 to simultaneously move laterally within slots 114 in socket plate20. As engagement members 102 simultaneously move laterally within slots114 in socket plate 20, the angled surfaces 110 of flanges 108 of arms106 simultaneously engage bearings 112 of top stiffener 38 therebysliding over bearings 112 while pulling top stiffener 38 toward socketplate 20. This movement continues until the angled surfaces 110 offlanges 108 of arms 106 pass the bearings 112 of top stiffener 38 andthe bearings 112 of top stiffener 38 are received in the flat orslightly recessed or detent area rearward of the angled surfaces 110 offlanges 108 of arms 106 at which point the locking mechanism 24 is in afully engaged position and the top stiffener 38 is fully pulled towardsocket plate 20.

In the arrangement shown, as one example, when top stiffener 38 is in afully engaged position, the electrical testing components 26 are lockedin place and an electrical connection is formed between DUT PCB 14 andelectrical testing components 26.

Electrical Testing Components:

In the arrangement shown, as one example, system 10 includes electricaltesting components 26. Electrical testing components 26 are formed ofany suitable size, shape and design and are configured to facilitatetesting of test socket 12 and/or DUT PCB 14. In the arrangement shown,as one example, electrical testing components 26 include card assemblies28 having motherboards 30, sockets 32 and electrical testing boards 34,among other components and features.

Card Assemblies: In the arrangement shown, as one example, electricaltesting components 26 are separated into a plurality of card assemblies28. Card assemblies 28 are formed of any suitable size, shape and designand are configured to be formed of a portion of the electrical testingcomponents 26 that are connected and packaged in a high density andefficient manner that is easily assembled and installed and thatfacilitates the functionality of the module 16.

In the arrangement shown, as one example, two card assemblies 28 areshown in use with each socket plate 20 and module 16. However, anynumber of card assemblies 28 are hereby contemplated for use with eachsocket plate 20 and module 16 such as one, two, three, four, five, six,seven, eight, nine, ten or more. In the arrangement shown, as oneexample, each card assembly 28 includes a motherboard 30, a plurality ofsockets 32, a plurality of electrical testing boards 34 and a pluralityof capsules 36, among other components and features.

Motherboards: In the arrangement shown, as one example, card assemblies28 include a motherboard 30. Motherboard 30 is formed of any suitablesize, shape and design and is configured to electrically connect andhold together a subset of the sockets 32, electrical testing boards 34and capsules 36 that form the electrical testing components 26.

In the arrangement shown, as one example, motherboard 30 is a generallyflat and planar member that is generally square or rectangular in shapewhen viewed from above or below, however any other shape is herebycontemplated for use. In the arrangement shown, as one example,motherboard 30 is what is known as a printed circuit board. In thearrangement shown, as one example, motherboard 30 has electricalcontacts in its upper surface 128 as well as electrical contacts in itslower surface 130. These electrical contacts in the upper surface 128extend through the layers of material that form motherboard 30 andelectrically connect to the electrical contacts in the lower surface130. These electrical contacts are configured to facilitate electricalconnection of electrical components to the upper surface 128 ofmotherboard 30 as well as to facilitate electrical connection ofelectrical components to the lower surface 130 of mother board 30. Saidanother way, motherboard 30 facilitates the electrical connection ofelectrical components connected to the upper surface 128 and lowersurface 130 of motherboard 30. In the arrangement shown, capsules 36 areconnected to the upper surface 128 of motherboard 30 and sockets 32 areconnected to the lower surface 130 of motherboard 30.

Sockets: In the arrangement shown, as one example, card assemblies 28include a plurality of sockets 32. Sockets 32 are formed of any suitablesize, shape and design and are configured to mechanically andelectrically connect to the lower surface 130 of motherboard 30 as wellas mechanically and electrically connect and hold electrical testingboards 34 therein.

In the arrangement shown, as one example, a plurality of sockets 32 areconnected to the lower surface 130 of motherboard 30 in approximateparallel spaced alignment to one another. Sockets 32 are configured tomechanically connect to the lower surface 130 of motherboard 30 as wellas electrically connect to the electrical contacts in the lower surface130 of motherboard 30. In the arrangement shown, as one example, sockets32 are configured to receive the upper end of electrical testing boards34. Sockets 32 form a mechanical connection as well as an electricalconnection to electrical testing boards 34. In this way, when the upperend of electrical testing boards 34 are received within sockets 32,sockets 32 serve to electrically connect electrical testing boards 34 tomotherboard 30.

In the arrangement shown, as one example, capsules 36 are connected tothe upper surface 128 of motherboard 30.

Capsule:

In the arrangement shown, as one example, electrical testing components26 include a plurality of capsules 36. Capsules 36 are formed of anysuitable size, shape and design and are configured to facilitate theelectrical connection between motherboard 30 and DUT PCB 14 whilefacilitating the easy installation and removal of DUT PCB 14 onto module16.

In the arrangement shown, as one example, capsules 36 include aplurality of compressible electrical contacts 132 in its upward facingsurface that extend upward therefrom and/or in its downward facingsurface that extend downward therefrom. Alternatively, the downwardfacing surface of capsules 36 include contact fields or sockets that areused to make electrical connections (instead of spring loaded orcompressible electrical contacts 132). These compressible electricalcontacts 132 are electrically connected to an electrical testing board34 at their lower end and are electrically connected to the DUT PCB 14at their upper end, as is further described herein. In this way capsules36 serve as an electrical interconnect between motherboard 30 and DUTPCB 14.

In the arrangement shown, as one example, capsules 36 are generallyrectangular in shape when viewed from above, below, the side or an end,and have generally planar upper surface and lower surfaces which opposeone another in approximate parallel spaced relation. In the arrangementshown, as one example, capsules 36 are formed of a pair of opposinghalves 134 that connect together in generally flush engagement with oneanother along a centrally extending seam line between the two halves 134when they are assembled. In the arrangement shown, as one example,halves 134 are held together by a plurality of fasteners 136, howeverany other manner of connection is hereby contemplated for use.

In the arrangement shown, as one example, compressible electricalcontacts 132 are known in the industry as pogo pins. A Pogo pin is adevice used in electronics to establish a (usually temporary) connectionbetween two printed circuit boards. Named by analogy with the pogo sticktoy, the pogo pin usually takes the form of a slender cylindercontaining two sharp, spring-loaded pins. Pressed between two electroniccircuits, the sharp points at each end of the pogo pin make securecontacts with the two circuits and thereby connect them together. In thearrangement shown, as one example, compressible electrical contacts 132extend out of both the upper surface as well as the lower surface ofcapsule 36. In this way, the upper end of compressible electricalcontacts 132 of capsules 36 are configured to electrically connect tothe electrical contacts 154 in the lower surface 156 of DUT PCB 14, andthe lower end of compressible electrical contacts 132 of capsules 36 areconfigured to electrically connect to the electrical contacts in theupper surface 128 of motherboard 30 while the compressible and forgivingnature of compressible electrical contacts 132 accommodates anyvariation between components.

In the arrangement shown, as one example, one or more alignment pins 138are positioned between opposing halves 134 and is configured tofacilitate precise alignment of opposing halves 134 during installation.Once capsules 36 are assembled, capsules 36 are installed onto the uppersurface 128 of motherboard 30 using fasteners 140.

Assembly & Installation: In the arrangement shown, as one example, oncecard assemblies 28 are assembled, with each card assembly 28 having asingle motherboard 30 having a plurality of sockets 32 connected to itslower surface 130 with an electrical testing board 34 positioned withineach socket 32, the card assemblies 28 are installed onto housing 18 andsocket plate 20. In doing so, the lower end of each electrical testingboard 34 is aligned with a corresponding socket 84 in socket plate 20.Once the lower ends of electrical testing boards 34 are properly alignedin this manner, the card assembly 28 is lowered onto housing 18 andsocket plate 20 until the lower surface 130 of motherboard 30 engagesthe upper surface 76 of socket plate 20. In doing so, care is taken toalign motherboard 30 appropriately with alignment pins 88 so as toensure proper and precise alignment.

Capsules 36 are installed onto the upper surface 128 of motherboard 30using fasteners 140 that extend through capsules 36 as well as throughmotherboard 30. The lower end of fasteners 140 thread into socket plate20 and in doing so, as fasteners 140 are tightened, fasteners 140 pullcapsules 36 into tight engagement with motherboard 30 and fasteners 140pull motherboard 30 into tight engagement with socket plate 20.

Capsules 36 are installed across the upper surface 128 of motherboard 30in approximate parallel spaced relation with each capsule 36 positionedabove a pair of sockets 32 and corresponding electrical testing boards34. Once capsules 36 are installed onto the upper surface 128 ofmotherboard 30, top stiffener 38 is installed over card assemblies 28and capsules 36.

Top Stiffener:

In the arrangement shown, as one example, modules 16 of testing system10 include a top stiffener 38. Top stiffener 38 is formed of anysuitable size, shape and design and is configured to connect to thelower surface 156 of DUT PCB 14 and provide strength and rigidity to DUTPCB as well as facilitate the connection of DUT PCB 14 to socket plate20.

In the arrangement shown, as one example, top stiffener 38 is agenerally planar member having a generally flat upper surface 142 and agenerally flat lower surface 144 that extend in approximate parallelplanar spaced relation to one another. In the arrangement shown, as oneexample, top stiffener 38 extends a width between opposing sides 146that extend in approximate parallel spaced relation to one another. Inthe arrangement shown, as one example, top stiffener 38 extends a lengthbetween opposing ends 148 that extend in approximate parallel spacedrelation to one another. In the arrangement shown, as one example, sides146 and ends 148 extend in approximate perpendicular alignment to oneanother thereby forming a generally square or rectangular member whenviewed from above or below. In the arrangement shown, as one example,upper surface 142 and opposing lower surface 144 and sides 146 extend inapproximate perpendicular alignment to one another thereby forming agenerally square or rectangular member when viewed from a side 146. Inthe arrangement shown, as one example, upper surface 142 and opposinglower surface 144 and ends 148 extend in approximate perpendicularalignment to one another thereby forming a generally square orrectangular member when viewed from an end 148.

Sockets: In the arrangement shown, as one example, top stiffener 38includes a plurality of sockets 150. Sockets 150 are formed of anysuitable size, shape and design and are configured to receive capsules36 connected to the upper surface 128 of motherboard 30 therein. Thisarrangement of sockets 150 and capsules 36 allows top stiffener 38 to beplaced on top of the upper surface 76 of socket plate 20 having cardassemblies 28 installed thereon with capsules 36 installed on the uppersurface of motherboards 30. Sockets 150 also serve to allow the uppersurface of capsules 36 to engage the lower surface 156 of DUT PCB 14 soas to facilitate electrical connection between capsules 36 and DUT PCB14.

In the arrangement shown, as one example, when viewed from above orbelow, sockets 150 are generally elongated square or rectangularopenings that extend through top stiffener 38 from upper surface 142 tolower surface 144. A plurality of sockets 150 extend in generallyparallel spaced relation to one another along the end 148 to end 148length of top stiffener 38 with the length of each socket 150 extendingacross the side 146 to side 146 width of top stiffener 38. These sockets150 are sized and shaped to receive capsules 36 therein while allowingcapsules 36 to electrically connect to motherboard 30 on their lowerside as well as electrically connect to DUT PCB 14 at their upper side.

Slots: In the arrangement shown, as one example, top stiffener 38 alsoincludes a plurality of slots 152. Slots 152 are formed of any suitablesize, shape and design and are configured to receive the upper end ofarms 106 of engagement members 102 of rack 96 of locking mechanism 24 soas to facilitate locking of top stiffener 38 and its attached DUT PCT 14to socket plate 20.

In the arrangement shown, as one example, when viewed from above orbelow, slots 152 are generally elongated square or rectangular openingsthat extend through top stiffener 38 from upper surface 142 to lowersurface 144 and are positioned in alignment with the upper ends of arms106 of engagement members 102 of rack 96 of locking mechanism 24 suchthat when top stiffener 38 is placed on top of socket plate 20, theupper end of arms 106 of engagement members 102 are received withinslots 152.

In the arrangement shown, as one example, a bearing 112 extendslaterally across slots 152. Bearings 112 are formed of any suitablesize, shape and design and are configured to be engaged by the upperends of arms 106 of engagement member 102 so as to facilitate locking oftop stiffener 38 to socket plate 20. In the arrangement shown, as oneexample, bearing 112 is a rotatable bearing that rotates around a shaftor axle that extends across the slot 152 and in this configurationbearing 112 extending across slot 152 has been tested with success andprovides smooth and consistent operation when engagement member 102moves between a disengaged position to an engaged position, as well aswhen engagement member 102 moves between an engaged position to adisengaged position. The upper surface 142 of top stiffener 38 isconnected to the lower surface 156 of DUT PCB 14 by a plurality offasteners that extend through DUT PCB 14 and into the material of topstiffener 38 thereby securing the DUT PCB 14 to top stiffener 38.

In one arrangement, when installing DUT PCB 14 upon top stiffener 38,care is taken to align the alignment holes or alignment features in DUTPCB 14 with the alignment pins 88 that extend upward from the uppersurface 76 of socket plate 20 and/or with alignment pins 88 that extendupward from the upper surface 142 of top stiffener 38. Alignment of DUTPCB 14 with alignment pins 88 provides quick, easy and precise alignmentof DUT PCB 14, top stiffener 38 and/or socket plate 20.

DUT PCB:

In the arrangement shown, as one example, testing system 10 includes DUTPCB 14. DUT PCB 14 is formed of any suitable size, shape and design andis configured to connect at its lower surface 156 to the upper surface142 of top stiffener 38 and is configured to receive one or more testsockets 12 in its upper surface. DUT PCB 14 is also configured tofacilitate electrical connection between test socket(s) 12 and theelectrical testing components 26 of module 16.

In the arrangement shown, as one example, DUT PCB 14 is a generally flatand planar member that is generally square or rectangular in shape whenviewed from above or below, however any other shape is herebycontemplated for use. In the arrangement shown, as one example, DUT PCB14 is what is known as a printed circuit board. In the arrangementshown, as one example, DUT PCB 14 has electrical contacts 154 in itslower surface 156 that are configured to be engaged by and electricallyconnected to compressible electrical contacts 132 of capsules 36 whenDUT PCB 14 and top stiffener 38 are placed on top of socket plate 20. Assuch, in the arrangement shown, electrical contacts 154 in lower surface156 of DUT PCB 14 are arranged in contact fields that match the size,shape and placement of the compressible electrical contacts 132 ofcapsules 36.

These electrical contacts 154 in the lower surface 156 of DUT PCB 14extend through the layers of material that form DUT PCB 14 andelectrically connect to the electrical contacts in the upper surface 158of DUT PCB 14 that electrically connect to compressible electricalcontacts 160 of test socket 12. These electrical contacts are configuredto facilitate electrical connection of electrical components to theupper surface 158 of DUT PCB 14 as well as to facilitate electricalconnection of electrical components to the lower surface 156 of DUT PCB14. Said another way, DUT PCB 14 facilitates the electrical connectionof electrical components connected to the upper surface 158 and lowersurface 156 of DUT PCB 14. In the arrangement shown, capsules 36 areelectrically connected to the lower surface 156 of DUT PCB 14 and testsocket(s) 12 are electrically connected to the upper surface 158 of DUTPCB 14.

Test Socket Electrical Interconnect:

In the arrangement shown, as one example, testing system 10 includes atleast one test socket 12, which may also be referred to as an electricalinterconnect herein. Test socket 12 is formed of any suitable size,shape and design and is configured to connect at its lower surface tothe upper surface 158 of DUT PCB 14 and is configured to receive adevice under test 162 (DUT 162), such as a semiconductor chip, areference chip, a shorting device, a reference standard or the like orany other form of a device simulator.

However, the disclosure herein is not limited to testing test sockets 12only. Instead, the disclosure is applicable to testing any device orsystem that forms an electrical connection or an electricalinterconnect.

Generally, test socket 12 will be specifically sized and shaped toreceive a particular matched DUT 162 within close and tight tolerancesand in mating engagement such that when DUT 162 is placed within testsocket 12 a strong and secure mechanical connection as well aselectrical connection between DUT 162 and test socket 12 is created. Inthe arrangement shown, as one example, test socket 12 is specificallysized and shaped to receive a particular matched DUT 162 within closeand tight tolerances and in mating engagement such that when theparticular DUT 162 is placed within test socket 12, DUT 162 is preciselyheld in place while facilitating a strong and secure mechanicalconnection as well as electrical connection between DUT 162 and testsocket 12.

In the arrangement shown, as one example, test socket 12 includes araised peripheral edge 164 which surrounds and provides a border to afield of compressible electrical contacts 160 positioned within theborder formed by raised peripheral edge 164 approximately at the centerof the test socket 12. However, any other size, shape and arrangement ishereby contemplated for use as test socket 12.

In the arrangement shown, as one example, test socket 12 is affixed tothe upper surface 158 of DUT PCB 14 using a plurality of fasteners 166that extend through raised peripheral edge 164 and into DUT PCB 14. Inthe arrangement shown, as one example, test socket 12 is attached to DUTPCB 14 at the approximate middle of DUT PCB 14 between opposing sets ofelectrical contacts 154 that extend along the sides of DUT PCB 14.

Test socket 12 includes a plurality compressible electrical contacts 160positioned at its approximate center within the border formed by raisedperipheral edge 164. These compressible electrical contacts 160 may besimilar if not identical to compressible electrical contacts 132 used incapsules 36, as is described herein, and as such reference is made tothat portion of this disclosure which is applied to test socket 12. Thatis, in one arrangement compressible electrical contacts 160 are known inthe industry as pogo pins. In the arrangement shown, as one example,compressible electrical contacts 160 extend out of both the uppersurface as well as the lower surface of test socket 12. In this way, theupper end of compressible electrical contacts 160 of test socket 12 areconfigured to electrically connect to electrical contacts in the lowersurface of DUT 162, and the lower end of compressible electricalcontacts 160 of test socket 12 are configured to electrically connect tothe electrical contacts in the upper surface 158 of DUT PCB 14 while thecompressible and forgiving nature of compressible electrical contacts160 accommodates any variation between components and thereby provides astrong and secure electrical connection.

When test socket 12 is secured to DUT PCB 14 the compressible electricalcontacts 160 of test socket 12 electrically connect to the electricalcontacts points on the upper surface 158 of DUT PCB 14 whichelectrically connect to electrical traces or leads that extend throughDUT PCB 14 and electrically connect to the electrical contacts 154positioned in the lower surface 156 of DUT PCB 14 at the outward sidesof DUT PCB 14 which connect to the compressible electrical contacts 132of capsules 36 which connect to sockets 32 which connect to electricaltesting boards 34. In this way, DUT PCB 14 serves to electricallyconnect test socket 12, and any DUT 162 positioned within test socket12, to the electrical testing components 26 (capsules 36, sockets 32,electrical testing boards 34, motherboards 30) positioned below the DUTPCB 14. As such, when DUT PCB 14 is placed on top of testing system 10,the compressible electrical contacts 160 of test socket 12 electricallyconnect through DUT PCB 14 to the electrical testing components 26.

In a manufacturing environment, DUT 162 is often a sophisticatedsemiconductor chip that provides sophisticated functionality andcapabilities in a tremendously compact size. However, in a testingenvironment, wherein test socket 12 is being tested, DUT 162 is often ashorting device or a reference standard that is configured to provide aknown result, such as a known resistance. Often, when DUT 162 is ashorting device it is a solid metallic or plated metallic device thathas a generally well-known resistance which is suitable for testingpurposes. Often, DUT 162 is a reference standard that mimics a certaincondition or provides an anticipated result that is useful for testingpurposes.

DUT 162 often has a very high density of electrical contacts in itslower surface (often referred to as a ball grid array or the like) thatelectrically connect the DUT 162 to the device DUT 162 is installed onto(such as a computer's motherboard, or the like). Accordingly, to testall of the electrical contacts DUT 162 has in its lower surface, testsocket 12 has a corresponding number of compressible electrical contacts160 that protrude upward from its upper surface.

Testing system 10 is configured to perform complex and sophisticatedtesting procedures on DUT 162 which require sophisticated and complexelectrical testing components 26 (as are described herein) that preformcomplex tasks (such as contact resistance, leakage, performance testing,etc.). DUT PCB 14 serves to connect the dense electrical contacts in thelower surface of DUT 162 to the electrical testing components 26 of thesystem 10 through a network of electrical traces embedded within the DUTPCB 14. As such, through its network of internal electrical leads (ortraces) DUT PCB 14 expands the dense concentration of electricalconnection points in the lower surface of DUT 162 outward and to thesides of DUT PCB 14 so as to provide room for the electrical testingcomponents 26 needed to perform the electrical tests to ensure DUT 162and/or test socket 12 is a conforming device and within spec. As such,through its network or electrical traces that expand outward from testsocket 12, DUT PCB 14 serves to provide additional room for the neededelectrical testing components 26 of system 10. While system 10 housesthe electrical testing components 26 in a very dense arrangement, thesurface area required for the electrical testing components 26 issubstantially greater than the surface area of the electrical contactsin the DUT 162 and test socket 12.

Assembly:

To assemble the testing system 10, a DUT PCB 14 is selected for theparticular test socket 12 that is being used and/or for the particularDUT 162 that is being manufactured and therefore needs to be tested.

The DUT PCB 14 will be different or custom for each different DUT 162and/or test socket 12. This is because each DUT 162 has a unique arrayof electrical contacts in its lower surface which require a specifictest socket 12 with compressible electrical contacts 160 correspondingto the unique array of electrical contacts for the particular DUT 162.Therefore, a specific DUT PCB 14 is also required to facilitateelectrical connection with compressible electrical contacts 160 of testsocket 12 for each DUT 162 and/or test socket 12.

While the electrical contacts in the upper surface 158 of the DUT PCB 14are unique for each DUT 162 and/or test socket 12, the electricalcontacts 154 in the lower surface 156 of DUT PCB 14 remain consistent.As such, countless DUTs 162 and/or test sockets 12 may be tested usingthe same test system 10 by simply removing and replacing the DUT PCB 14.This allows for removal and replacement of the DUT PCB 14 to be donewith ease, which is an objective the system 10 accomplishes.

Once selected, the DUT PCB 14 is placed on top of the testing system 10.More specifically, the DUT PCB 14 is aligned with the alignment pins 88that extend upward from the upper surface 76 of socket plate 20. Onceproperly aligned with alignment pins 88, the lower surface 156 of DUTPCB 14 is lowered toward the upper surface 76 of socket plate 20 untilthe electrical contacts 154 in the lower surface 156 of DUT PCB 14 arein electrical contact with the compressible electrical contacts 132 thatprotrude upward from the upper surface of capsules 36. In this position,the electrical contacts 154 in the lower surface 156 of DUT PCB 14physically engage the compressible electrical contacts 132 of thecapsules 36 which are held within the sockets 150 of top stiffener 38.In this way, the DUT PCB 14 is electrically connected to the electricaltesting boards 34 of electrical testing components 26.

As the DUT PCB 14 is lowered onto and over socket plate 20 with the cardassemblies 28 installed onto the socket plate 20, the capsules 36 arereceived within the sockets 150 in top stiffener 38. Simultaneously, asthe DUT PCB 14 is lowered onto and over socket plate 20 with the cardassemblies 28 installed onto the socket plate 20, the upper ends of arms106 of engagement member 102 of rack 96 of locking mechanism 24 arereceived within the slots 152 of top stiffener 38. Once the DUT PCB 14is lowered onto and over socket plate 20, and the upper ends of arms 106of engagement member 102 of rack 96 of locking mechanism 24 are receivedwithin the slots 152 of top stiffener 38, the flanges 108 and angledsurfaces 110 of engagement member 102 point toward (but are disengagedfrom) bearings 112 that extend across slots 152 of top stiffener 38.

Once in this position, with the flanges 108 and angled surfaces 110 ofengagement member 102 pointing toward (but disengaged from) bearings 112that extend across slots 152 of top stiffener 38, the top stiffener 38is ready to be locked into place using locking mechanism 24. To lock topstiffener 38 in place over socket plate 20 and card assemblies 28, theactuating mechanism 22 is actuated.

In the arrangement shown, as one example, when actuating mechanism 22 isa manual lever having an arm 116 and handle 118, a user grasps thehandle 118 and rotates it in a closing direction or an engagementdirection. This rotation of the outward end of arm 116 causes the post90 connected to the inward end of arm 116 to rotate in an engagementdirection. As the post 90 connected to the inward end of arm 116rotates, this causes the tab 120 that extends outward from head 92 tosimilarly rotate. As tab 120 rotates, this rotation is translated tolinkage 122 through the connection of the outward end of tab 120 tolinkage 122 by way of fastener 124. As such, as post 90 rotates and tab120 moves, this causes linkage 122 to move laterally. As linkage 122moves laterally, linkage 122 causes the other posts 90 that areconnected to linkage 122 to simultaneously rotate. As such, as one post90 rotates, all posts 90 rotate.

As the upper end of posts 90 rotate, so rotates the lower end of posts90 which are positioned below the lower surface 78 of socket plate 20.As the lower end of posts 90 rotate, so rotates the pinion 94 connectedto the lower end of posts 90. As pinions 94 rotate, the gear teeth ofpinions 94 mesh with the gear teeth of racks 96 and as such, therotational movement of pinions 94 cause lateral movement of racks 96. Asracks 96 move laterally, this simultaneously causes engagement members102 connected to the upper surface 104 of racks 96 to move laterallywithin slots 114 in socket plate 20 as well as within slots 152 of topstiffener 38.

As engagement members 102 move in a closing direction or an engagementdirection, the upper end of arms 106 move toward bearings 112 thatextend across slots 152 of top stiffener 38. As the upper end of arms106 move toward bearings 112 the angled surface 110 of the lower side offlanges 108 at the upper end of arms 106 of engagement members 102engage bearings 112 that extend across slots 152 of top stiffener 38. Asthe angled surface 110 of the lower side of flanges 108 at the upper endof arms 106 of engagement members 102 increasingly engage bearings 112the angle of these angled surfaces 110 cause top stiffener 38 to beincreasingly pulled downward toward socket plate 20. Notably, due to theengagement between top stiffener 38 and alignment pins 88 of socketplate 20, as engagement members 102 engage bearings 112 of top stiffener38 the top stiffener 38 is prevented from laterally moving. However, dueto the engagement between top stiffener 38 and alignment pins 88 ofsocket plate 20, as engagement members 102 engage bearings 112 of topstiffener 38 the top stiffener 38 is free to move vertically toward (andaway) from socket plate 20.

As the angled surface 110 of the lower side of flanges 108 at the upperend of arms 106 of engagement members 102 engage bearings 112 theseangled surfaces 110 slide or roll over bearings 112 extending acrossslots 152 in top stiffener 38. This lateral movement of engagementmembers 102 continue until the angled surface 110 of the lower side offlanges 108 at the upper end of arms 106 of engagement members 102 passthe bearings 112 at which point, top stiffener 38 is fully pulled downand toward socket plate 20. In this position, the bearings 112 thatextend across slots 152 of top stiffener 38 are received by the flat orslightly recessed or detent surface in the lower surface of flanges 108just rearward of the angled surface 110. At this point, the engagementmembers 102 are in a fully engaged position.

The opposite process is performed to move from the engaged position tothe disengaged position.

A similar process is performed when a motorized actuating mechanism 22is used, such as a motor, solenoid, hydraulic or pneumatic cylinder orother mechanism, that replaces arm 116 and handle 118 and facilitatesrotation of posts 90.

When engagement members 102 are in a fully closed or fully engagedposition, top stiffener 38 is fully pulled down and toward socket plate20. This causes capsules 36 connected to the upper surface 128 ofmotherboard 30 to be received within sockets 150 of top stiffener 38 andcauses the compressible electrical contacts 132 in the upper surface ofcapsules 36 to engage the electrical contacts 154 in the lower surface156 of DUT PCB 14 thereby forming an electrical connection betweenelectrical testing components 26 and DUT PCB 14.

Test socket 12 is installed onto DUT PCB 14 by precisely aligning thetest socket 12 with the electrical contacts in the upper surface 158 ofDUT PCB 14 such that the compressible electrical contacts 160 thatextend outward from the lower surface of test socket 12 engage theelectrical contacts in the upper surface 158 of DUT PCB 14. Onceproperly aligned, test socket 12 is affixed to DUT PCB 14 usingfasteners 166. As test socket 12 is tightened against DUT PCB 14, thecompressible electrical contacts 160 that extend outward from the lowersurface of test socket 12 engage the electrical contacts in the uppersurface 158 of DUT PCB 14, and slightly compress, and form a strong anddurable electrical connection with DUT PCB 14. DUT PCB 14 facilitatesthe electrical connection between test socket 12 on its upper surface158, with capsules 36 and electrical testing components 26 on its lowersurface 156.

Once test socket 12 is installed onto DUT PCB 14, DUT 162 is installedinto test socket 12. DUT 162 is installed into test socket 12 byprecisely aligning DUT 162 with the test socket 12 and lowering the DUT162 into the test socket 12 until the electrical contacts in the lowersurface of the DUT 162 engage the compressible electrical contacts 160of test socket 12. In one arrangement, DUT 162 may be pressed down intotest socket 12 using a stepper 168 or other component to ensure a strongand durable electrical connection between DUT 162 and test socket 12.

Once the system 10 is fully assembled, and DUT 162 is in place withintest socket 12, DUT 162 and/or test socket 12 may be tested by system 10by transmitting electrical signals from the electrical testingcomponents 26 through DUT PCB 14, through test socket 12 and through DUT162.

More specifically, the electrical testing boards 34 send and receiveelectrical signals through the edge connectors of sockets 32. Thesesignals then transmit through motherboard 30 and into the capsules 36.More specifically, the electrical signals pass through the compressibleelectrical contacts 132 of capsules 36 and into the contact fields ofDUT PCB 14. These electrical signals travel through the DUT PCB 14through a series of electrical traces within the layers of the DUT PCB14 and into the test socket 12. These electrical signals then passthrough the test socket 12 and into the DUT 162. These electricalsignals travel through the DUT 162 and back to the electrical testingboards 34 through the same or a similar but reverse path; and theprocess repeats. The electrical testing components 26 measure thesesignals and how the test socket 12 and/or DUT 162 act/react and therebydetermine the operational characteristics of socket 12 and/or DUT 162and determine whether socket 12 and/or DUT 162 is conforming ornon-conforming.

Once the test is complete, socket 12 and/or DUT 162 is removed andanother socket 12 and/or DUT 162 is installed and the process isrepeated. Alternatively, the DUT PCB 14 is removed and replaced with adifferent DUT PCB 14 so as to facilitate testing another but differentsocket 12 and/or DUT 162.

In this way, various sockets 12 and/or DUTs 162 may be tested usingsystem 10 by simply removing and replacing DUT PCB 14 which can quicklyand easily be done.

Infinite Top Plane:

One of the substantial benefits of the system 10 is that the uppersurface 158 of DUT PCB 14 is uninterrupted. Or, said another way, otherthan the test socket(s) 12 being installed onto the upper surface 158 ofDUT PCB 14 the upper surface 158 of DUT PCB 14 is a completely flatplane that is unencumbered and has no upwardly protruding elementsthereon. In addition, no additional elements are installed onto theupper surface 158 of DUT PCB 14 to lock the DUT PCB 14 onto socket plate20. This infinite top plane or uninterrupted top plane of the uppersurface 158 of DUT PCB 14 means that there is no interference and assuch the system 10 can be used with practically any other equipment ormachinery, such as pick and place machines, robots, handlers,environmental chambers, gantries, or the like or any other device,equipment or system. In the arrangement shown, as one example, only testsocket 12 is attached to the upper surface 158 of DUT PCB 14.

Placement of Test Socket and/or DUT:

Another substantial benefit of an uninterrupted upper surface 158 of DUTPCB 14 is that one or more test sockets 12 and/or DUTs 162 may be placedat any location on upper surface 158 of DUT PCB 14. In other words,because upper surface 158 of DUT PCB 14 is a flat plane that isunencumbered, test socket 12 s and/or DUTs 162 may be located at thecenter of upper surface 158 of DUT PCB 14, they may be located adjacenteither side of DUT PCB 14, they may be located adjacent either end ofDUT PCB 14, or any other location on upper surface 158 of DUT PCB 14.This allows for greater flexibility of the system 10 and moreopportunities to efficiently use other equipment or machinery, such aspick and place machines, robots, handlers, environmental chambers,gantries, or any other device, equipment, or system, that may havelimited maneuverability. Or, said another way, the infinite top plane ofDUT PCB 14 allows system 10 to be used with practically any otherequipment or machinery, such as pick and place machines, robots,handlers, environmental chambers, gantries, or any other device,equipment, or system.

Placement of Stiffener:

Another substantial benefit of the system 10 is that top stiffener 38can connect to the lower surface 156 of DUT PCB 14 at any location onthe lower surface 156 of DUT PCB 14. In other words, top stiffener 38may connect to the lower surface 156 of DUT PCT 14 at the center of thelower surface 156 of DUT PCB 14, it may connect adjacent either side ofDUT PCB 14, it may connect adjacent either end of DUT PCB 14, or anyother position on the lower surface 156 of DUT PCB 14 in order toprovide strength and rigidity to DUT PCB 14 and facilitate connection ofDUT PCB 14 to socket plate 20. This allows for greater flexibility inthe size and shape of both DUT PCB 14 and top stiffener 38.Additionally, multiple top stiffeners 38 can connect to the lowersurface 156 of DUT PCB 14 at once because top stiffener 38 can connectto the lower surface 156 of DUT PCB 14 at any location. This allows formultiple modules 16 to be connected to DUT PCB 14 at one time, whichincreases the benefit of the system 10 as described herein.

No Border:

One of the substantial benefits of the system 10 is that the uppersurface 158 of DUT PCB 14 is practically not limited in size or shape.That is, because top stiffener 38 is attached to the lower surface 156of DUT PCB 14 and then the combined DUT PCB 14 and top stiffener 38 isplaced on top of socket plate 20, there is no border limiting the sizeor shape of DUT PCB 14. As such, users can develop DUT PCBs 14 that areof practically any size and shape. This is important because manydifferent machines used in association with system 10 have varyingrequirements and limitations. Due to the flexible nature of the system10, DUT PCBs 14 can be developed to suit whatever the user's needs arebased on existing equipment and manufacturing requirements.

Modularity:

One of the substantial benefits of the system 10 is that the system 10is modular in nature. That is, coupled with or in association with thebenefits mentioned above, the infinite top plane of DUT PCB 14 and theborderless top plane of DUT PCB 14, a testing system 10 can be formedout of any number of modules 16 which may be placed in any alignment andarrangement. That is, a testing system 10 may be formed of one, two,three, four, five, six, seven, eight, nine, ten or more modules 16 allof which may be electrically connected to the same DUT PCB 14 or todifferent DUT PCBs 14 or to multiple DUT PCBs 14. The number of modules16 needed is dependent on the pin density of the test socket 12. In onearrangement, a single module 16 has the capability of testing up to8,064 pins, which is substantially higher than any other similar testingsolution presently available on the market. As such, by combining twomodules 16 up to 2×8,064=16,128 pins can be tested; by combining threemodules 16 up to 3×8,064=24,192 pins can be tested; by combining fourmodules 16 up to 4×8,064=32,256 pins can be tested; and so on. Thisprovides never before met testing capability and higher pin density. Theconfiguration of the modules 16 may be chosen based upon spacerequirements, board design, mechanical requirements of other machines,etc.

As one example of this modularity, with reference to FIGS. 21 and 22, atesting system 10 is presented that is formed of a single module 16having a single DUT PCB 14 attached thereto with two test sockets 12attached to the DUT PCB 14. In this arrangement, the module 16 isconnected to one side of DUT PCB 14 with the opposite side of DUT PCB 14supported by a pedestal 170.

As another example, with reference to FIGS. 23, 24, 25, 26, 27 and 28, atesting system 10 is presented that is formed of a pair of modules 16having a single DUT PCB 14 attached thereto with a single test sockets12 attached to the DUT PCB 14. In this arrangement, the modules 16 areconnected to opposing sides of DUT PCB 14 with a pedestal 170 placedbetween the modules 16 and under the DUT PCB 14.

System 10 can essentially take on any form with any number of modules16. Examples include:

-   -   One module 16 positioned on one side of DUT PCB 14.    -   Two modules 16, one positioned on opposing sides of the DUT PCB        14.    -   Two modules 16, both positioned on one side of the DUT PCB 14 in        a lengthwise arrangement.    -   Two modules 16, both positioned on one side of the DUT PCB 14 in        a side-by-side parallel arrangement.    -   Two modules 16, one positioned on one side and the other        positioned on an adjacent side of the DUT PCB 14, such as an        L-shape.    -   Three modules 16, all positioned on one side of the DUT PCB 14        in a lengthwise arrangement.    -   Three modules 16, all positioned on one side of the DUT PCB 14        in a side-by-side parallel arrangement.    -   Three modules 16, positioned in a C-shape around the DUT PCB 14.    -   Four modules 16, all positioned on one side of the DUT PCB 14 in        a lengthwise arrangement.    -   Four modules 16, all positioned on one side of the DUT PCB 14 in        a side-by-side parallel arrangement.    -   Four modules 16, positioned in a square-shape around the DUT PCB        14.

Any other shape or configuration of modules 16 is hereby contemplatedfor use.

Self-Contained Socket Plate:

One of the substantial benefits of the system 10 is that the socketplate 20 is self-contained meaning that the actuating mechanism 22 andlocking mechanism 24 is fully attached to and contained in the socketplate 20. As such, the height and dimensions of housing 18 can changewithout affecting the manner in which the DUT PCB 14 attaches to thesystem 10.

Environmental Chamber and Stepper:

As one example of the many configurations that system 10 may take, withreference to FIGS. 26, 27 and 28, an environmental chamber 172 isattached to the upper surface 158 of DUT PCB 14. In many applications,such as defense, aerospace, space, automotive, marine, and others, DUTs162 must be tested at extreme high and/or low temperatures. Tofacilitate this testing, in the arrangement shown in FIGS. 26, 27 and28, an environmental chamber 172 is attached to the upper surface 158 ofDUT PCB 14. Environmental chamber 172 may be formed of any suitablesize, shape and design and is configured to test the test socket 12 aswell as DUT 162 under extreme conditions, such as high and/or lowtemperatures. In the arrangement shown, as one example, environmentalchamber 172 is a generally box shaped member having a door 174 andstepper 168 attached to the upper surface 158 of DUT PCB 14. Due to theinfinite top plane of DUT PCB 14, environmental chamber 172 is easilyattached and used in association with system 10.

Docking Station:

As one example of the many configurations that system 10 may take, withreference to FIGS. 23, 24, 25, a docking station 176 is attached to apair of modules 16. Docking station 176 may be formed of any suitablesize, shape and design and is configured to attach a wider variety ofDUT PCBs 14 to modules 16 so as to facilitate testing a wider variety ofDUT PCBs 14 and test sockets 12 as well as to make system 10 compatiblewith a wider variety of installed systems. Due to the infinite top planeof DUT PCB 14, and the modularity of the system 10, the docking station176 is easily attached and used in association with system 10.

In the arrangement shown, as one example, docking station 176 includes apair of DUT PCBs 14 that connect to docking station 176 in the waysshown and described herein with the use of top stiffeners 38. These DUTPCBs 14 then connect to a secondary DUT PCB 14 by way of connectors 178that serve to connect the first layer of DUT PCBs 14 to the second layerof DUT PCBs 14, which is often the end user's existing DUT PCB 14. Theseconnectors 178 may take on a similar configuration and serve a similarfunction as the socket plate 20 and top stiffener 38 described herein.As such, the use of docking station 176 allows system 10 and modules 16to be used with a wider variety of DUT PCBs 14 and test sockets 12.

From the above discussion, it will be appreciated that an electronictesting system and method of use is presented that improves upon thestate of the art.

Specifically, the electronic testing system and method of use aspresented: quickly converts between configurations for testing differentsemiconductor chips; easily converts between configurations for testingdifferent semiconductor chips; is easy to use; provides accurate testingfor semiconductor chips; can be used with a wide variety ofsemiconductor chips; is inexpensive; has a long useful life; has a smallfootprint; minimizes the amount of space required to test a variety ofsemiconductor chips; minimizes the capital cost for testing equipmentfor testing a variety of semiconductor chips; provides for quick removalof and replacement of DUT PCBs having electrical interconnects thereon;is high quality; and is durable, among countless other advantages andimprovements.

It will be appreciated by those skilled in the art that other variousmodifications could be made to the device without parting from thespirit and scope of this disclosure. All such modifications and changesfall within the scope of the claims and are intended to be coveredthereby.

1. A testing system, comprising: a housing; the housing forming a hollowinterior; a socket plate; the socket plate connected to the housing; alocking mechanism; the locking mechanism operably connected to thehousing; an actuating mechanism; the actuating mechanism operablyconnected to the locking mechanism; the actuating mechanism configuredto move the locking mechanism between a disengaged position and anengaged position; a plurality of electrical testing boards; wherein theplurality of electrical testing boards are positioned within at least aportion of the hollow interior of the housing; a device under testprinted circuit board (DUT PCB); the DUT PCB having an upper surface anda lower surface; a plurality of electrical contacts positioned in thelower surface of the DUT PCB; a top stiffener; the top stiffenerconnected to the lower surface of the DUT PCB; wherein when the topstiffener is placed on the socket plate and the actuating mechanismmoves the locking mechanism from the disengaged position to the engagedposition an electrical connection is made between the DUT PCB and theplurality of electrical testing boards; wherein the locking mechanismincludes at least one engagement member that moves laterally therebyforcing the DUT PCB toward the socket plate.
 2. The system of claim 1,wherein the locking mechanism directly engages the top stiffener belowthe DUT PCB.
 3. The system of claim 1, wherein the actuating mechanismis selected from the group consisting of: a lever; a hand operatedmechanism; and a motor.
 4. The system of claim 1, wherein the pluralityof electrical testing boards are connected to a motherboard.
 5. Thesystem of claim 1, wherein the plurality of electrical testing boardsare connected to a motherboard, wherein the motherboard is placed on topof the socket plate and below the top stiffener.
 6. The system of claim1, further comprising: a motherboard electrically connected to theplurality of electrical testing boards; a plurality of capsulespositioned between the motherboard and the DUT PCB; wherein theplurality of capsules facilitate electrical connection between themotherboard and the DUT PCB.
 7. The system of claim 1, furthercomprising a plurality of alignment pins connected to the socket plate;wherein the top stiffener is aligned by engagement with the plurality ofalignment pins.
 8. The system of claim 1, wherein the locking mechanismincludes a rack and pinion.
 9. The system of claim 1, wherein theengagement member includes a pair of arms that extend toward a portionof the top stiffener and engage the top stiffener thereby pulling thetop stiffener toward the socket plate.
 10. The system of claim 1,wherein the engagement member includes a pair of arms that includeangled surfaces that extend toward a portion of the top stiffener andengage the top stiffener thereby pulling the top stiffener toward thesocket plate.
 11. The system of claim 1, wherein the engagement memberincludes a pair of arms that extend toward a portion of the topstiffener and engage bearings of the top stiffener thereby pulling thetop stiffener toward the socket plate.
 12. The system of claim 1,wherein the locking mechanism includes three engagement members eachhaving a pair of arms that extend toward a portion of the top stiffenerand engage the top stiffener with one engagement member positioned atthe approximate middle of the socket plate and one engagement memberpositioned adjacent the outward ends of the socket plate.
 13. The systemof claim 1, further comprising a test socket connected to the uppersurface of the DUT PCB.
 14. The system of claim 1, wherein the uppersurface of the DUT PCB is flat and uninterrupted thereby providing aflat surface for other machines to engage the DUT PCB.
 15. The system ofclaim 1, wherein the plurality of electrical testing boards areconfigured to test a test socket connected to the DUT PCB.
 16. A testingsystem, comprising: a housing; the housing forming a hollow interior; asocket plate; the socket plate connected to the housing; a lockingmechanism; the locking mechanism operably connected to the socket plate;the locking mechanism having a rack and pinion; an actuating mechanism;the actuating mechanism operably connected to the locking mechanism; theactuating mechanism configured to move the locking mechanism between adisengaged position and an engaged position; a plurality of electricaltesting boards; wherein the plurality of electrical testing boards arepositioned within at least a portion of the hollow interior of thehousing; a device under test printed circuit board (DUT PCB); the DUTPCB having an upper surface and a lower surface; a plurality ofelectrical contacts positioned in the lower surface of the DUT PCB; atop stiffener; the top stiffener connected to the lower surface of theDUT PCB; wherein when the top stiffener is placed on the socket plateand the actuating mechanism moves the locking mechanism from thedisengaged position to the engaged position an electrical connection ismade between the DUT PCB and the plurality of electrical testing boards.17. The system of claim 16, wherein the locking mechanism directlyengages the top stiffener below the DUT PCB.
 18. The system of claim 16,wherein the locking mechanism moves laterally while pulling the DUT PCBtoward the socket plate.
 19. The system of claim 16, wherein theactuating mechanism is selected from the group consisting of: a lever; ahand operated mechanism; and a motor.
 20. The system of claim 16,wherein the plurality of electrical testing boards are connected to amotherboard.
 21. The system of claim 16, wherein the plurality ofelectrical testing boards are connected to a motherboard, wherein themotherboard is placed on top of the socket plate and below the topstiffener.
 22. The system of claim 16, further comprising: a motherboardelectrically connected to the plurality of electrical testing boards; aplurality of capsules positioned between the motherboard and the DUTPCB; wherein the plurality of capsules facilitate electrical connectionbetween the motherboard and the DUT PCB.
 23. The system of claim 16,further comprising a plurality of alignment pins connected to the socketplate; wherein the top stiffener is aligned by engagement with theplurality of alignment pins.
 24. The system of claim 16, wherein thelocking mechanism includes an engagement member having a pair of armsthat extend toward the top stiffener and engage the top stiffenerthereby pulling the top stiffener toward the socket plate.
 25. Thesystem of claim 16, wherein the locking mechanism includes an engagementmember having a pair of arms that include angled surfaces that extendtoward the top stiffener and engage the top stiffener thereby pullingthe top stiffener toward the socket plate.
 26. The system of claim 16,wherein the locking mechanism includes an engagement member having apair of arms that extend toward the top stiffener and engage bearings ofthe top stiffener thereby pulling the top stiffener toward the socketplate.
 27. The system of claim 16, wherein the locking mechanismincludes three engagement members each having a pair of arms that extendtoward and engage the top stiffener with one engagement memberpositioned at the approximate middle of the socket plate and oneengagement member positioned at the outward ends of the socket plate.28. The system of claim 16, further comprising a test socket connectedto the upper surface of the DUT PCB.
 29. The system of claim 16, whereinthe upper surface of the DUT PCB is flat and uninterrupted therebyproviding a flat surface for other machines to engage the DUT PCB. 30.The system of claim 16, wherein the plurality of electrical testingboards are configured to test a test socket connected to the DUT PCB.31. A testing system, comprising: a housing; the housing forming ahollow interior; a socket plate; the socket plate connected to thehousing; a locking mechanism; the locking mechanism operably connectedto the socket plate; the locking mechanism having a rack and pinion; anactuating mechanism; the actuating mechanism operably connected to thelocking mechanism; the actuating mechanism configured to move thelocking mechanism between a disengaged position and an engaged position;a plurality of electrical testing boards; wherein the plurality ofelectrical testing boards extend in approximate parallel spacedalignment within at least a portion of the hollow interior of thehousing; a device under test printed circuit board (DUT PCB); the DUTPCB having an upper surface and a lower surface; a plurality ofelectrical contacts positioned in the lower surface of the DUT PCB; atop stiffener; the top stiffener connected to the lower surface of theDUT PCB; wherein when the top stiffener is placed on the socket plateand the actuating mechanism moves the locking mechanism from thedisengaged position to the engaged position an electrical connection ismade between the DUT PCB and the plurality of electrical testing boards;wherein the locking mechanism includes an engagement member that moveslaterally thereby forcing the DUT PCB toward the socket plate.
 32. Thesystem of claim 31, wherein the locking mechanism directly engages thetop stiffener below the DUT PCB.
 33. The system of claim 31, wherein theactuating mechanism is selected from the group consisting of: a lever; ahand operated mechanism; and a motor.
 34. The system of claim 31,wherein the plurality of electrical testing boards are connected to amotherboard.
 35. The system of claim 31, wherein the plurality ofelectrical testing boards are connected to a motherboard, wherein themotherboard is placed on top of the socket plate and below the topstiffener.
 36. The system of claim 31, further comprising a plurality ofalignment pins connected to the socket plate; wherein the top stiffeneris aligned by engagement with the plurality of alignment pins.
 37. Thesystem of claim 31, wherein the engagement member includes a pair ofarms that extend toward the top stiffener and engage the top stiffenerthereby pulling the top stiffener toward the socket plate.
 38. Thesystem of claim 31, wherein the engagement member includes a pair ofarms that include angled surfaces that extend toward the top stiffenerand engage the top stiffener thereby pulling the top stiffener towardthe socket plate.
 39. The system of claim 31, wherein the engagementmember includes a pair of arms that extend toward the top stiffener andengage bearings of the top stiffener thereby pulling the top stiffenertoward the socket plate.
 40. The system of claim 31, wherein theengagement member includes a pair of arms that extend toward and engagethe top stiffener with one engagement member positioned at theapproximate middle of the socket plate and one engagement memberpositioned at the outward ends of the socket plate.
 41. A testingsystem, comprising: a housing; the housing forming a hollow interior; asocket plate; the socket plate connected to the housing; a lockingmechanism; the locking mechanism operably connected to the socket plate;the locking mechanism having a plurality of engagement members that eachmove laterally by a rack and pinion; an actuating mechanism; theactuating mechanism operably connected to the locking mechanism; theactuating mechanism configured to move the locking mechanism between adisengaged position and an engaged position; a plurality of electricaltesting boards; wherein the plurality of electrical testing boards arepositioned within at least a portion of the hollow interior of thehousing; a device under test printed circuit board (DUT PCB); the DUTPCB having an upper surface and a lower surface; a plurality ofelectrical contacts positioned in the lower surface of the DUT PCB; atop stiffener; the top stiffener connected to the lower surface of theDUT PCB; wherein when the top stiffener is placed on the socket plateand the actuating mechanism moves the locking mechanism from thedisengaged position to the engaged position an electrical connection ismade between the DUT PCB and the plurality of electrical testing boards.42. The system of claim 41, wherein the locking mechanism directlyengages the top stiffener below the DUT PCB.
 43. A testing system,comprising: a housing; a socket plate; the socket plate connected to thehousing; a locking mechanism; the locking mechanism operably connectedto the housing; an actuating mechanism; the actuating mechanismconfigured to move the locking mechanism between a disengaged positionand an engaged position; a plurality of electrical testing boards; adevice under test printed circuit board (DUT PCB); the DUT PCB having anupper surface and a lower surface; a plurality of electrical contactspositioned in the lower surface of the DUT PCB; a top stiffener; the topstiffener connected to the lower surface of the DUT PCB; wherein whenthe top stiffener is placed on the socket plate and the actuatingmechanism moves the locking mechanism from the disengaged position tothe engaged position an electrical connection is made between the DUTPCB and the plurality of electrical testing boards; wherein the lockingmechanism moves laterally thereby forcing the DUT PCB toward the socketplate.
 44. A testing system, comprising: a housing; a socket plate; thesocket plate connected to the housing; a locking mechanism; the lockingmechanism operably connected to the socket plate; the locking mechanismhaving a rack and pinion; an actuating mechanism; the actuatingmechanism configured to move the locking mechanism between a disengagedposition and an engaged position; a plurality of electrical testingboards; a device under test printed circuit board (DUT PCB); the DUT PCBhaving an upper surface and a lower surface; a plurality of electricalcontacts positioned in the lower surface of the DUT PCB; a topstiffener; the top stiffener connected to the lower surface of the DUTPCB; wherein when the top stiffener is placed on the socket plate andthe actuating mechanism moves the locking mechanism from the disengagedposition to the engaged position an electrical connection is madebetween the DUT PCB and the plurality of electrical testing